TSMC 7nm EUV-Prozess geht im März 2019 in Serie



TSMC is giving final touches to set its flagship 7 nanometer EUV (extreme ultraviolet lithography) silicon fabrication node at its highest state of readiness for business, called mass-production. At this state, the node can mass-produce products for TSMC's customers. TSMC had taped out its first 7 nm EUV chips in October 2018. The company will also begin risk-production of the more advanced 5 nm node in April, staying on schedule. Mass production of 5 nm chips could commence in the first half of 2020.

Der 7-nm-EUV-Knoten erweitert den bereits seit April 2018 aktiven 7-nm-DUV-Knoten (Deep Ultraviolet Lithography) von TSMC und produziert Chips für AMD, Apple, HiSilicon und Xilinx. Zum Jahreswechsel machten 7-nm-DUV 9 Prozent der TSMC-Lieferungen aus. Wenn der neue Knoten online geht, könnten 7 nm (DUV + EUV) bis Ende 2019 25 Prozent der TSMC-Ausgabe ausmachen.
Source: DigiTimes